Nonvolatile memory device and method for fabricating the same

ABSTRACT

A nonvolatile memory device includes a floating gate formed over a semiconductor substrate, an insulator formed on a first sidewall of the floating gate, a dielectric layer formed on a second sidewall and an upper surface of the floating gate, and a control gate formed over the dielectric layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims priority of Korean Patent Application No.10-2011-0049239, filed on May 24, 2011, which is incorporated herein byreference in its entirety.

BACKGROUND

1. Field

Exemplary embodiments of the present invention relate to a method forfabricating a semiconductor device, and more particularly, to anonvolatile memory device and a method for fabricating the same.

2. Description of the Related Art

In order to realize high integration, a NAND flash memory, which is anonvolatile memory device, includes a plurality of cells, which arecoupled in series to form a unit string. NAND flash memories are capableof substituting a memory stick, a USB driver, and a hard disk.

During a fabrication process of the NAND flash memory, a selfaligned-shallow trench isolation (SA-STI) process or advanced selfaligned-shallow trench isolation (ASA-STI) process is applied to realizeelement isolation and form a floating gate.

FIG. 1 is a diagram illustrating a conventional nonvolatile memorydevice.

Referring to FIG. 1, a plurality of active regions 13 isolated by aplurality of trenches 12 are formed in a substrate 11. A tunnelisolation layer 14 is formed on each of the active regions 13, and afloating gate 15 is formed on the tunnel isolation layer 14. Anisolation layer 16 is buried in each of the trenches 12, and the uppersurface of the isolation layer 16 is positioned lower than the uppersurface of the floating gate 15. A dielectric layer 17 is formed on theentire surface of the resultant structure including the floating gate 15and the isolation layer 16. The dielectric layer 17 has anoxide-nitride-oxide (ONO) structure including an oxide 17A, a nitride17B, and an oxide 17C. A control gate 18 is formed on the dielectriclayer 17.

In FIG. 1, the plurality of trenches 12 for isolating the plurality ofactive regions 13 are spaced at even intervals from each other. Thefloating gate 15 has both sidewalls contacted with the dielectric layer17, and the control gate 18 is formed over the dielectric layer 17 bothabove and between the floating gates 15.

As the NAND flash memory is highly integrated, a 20-nm class NAND flashmemory may employ symmetrical floating gates. More specifically, asillustrated in FIG. 1, spaces S1 to S3 are equal to each other(S1=S2=S3), and both sidewalls of the floating gate 16 contact thedielectric layer 17.

In the conventional nonvolatile memory device, however, since the spacebetween the floating gates 15 is small, securing a physical space wherethe control gate 18 is to be formed after the dielectric layer 17 isdeposited is difficult.

To secure the physical space for the control gate 18, the criticaldimension (CD) of the active region 13 may be reduced to increase the CDof the trench 12 and the space between the floating gates 15. However,since the spaces between the respective floating gates 15 are equal insize, it is not easy to secure the physical space. Therefore, using thefloating gate 15 may be limited.

SUMMARY

An embodiment of the present invention is directed to a nonvolatilememory device capable of sufficiently securing a physical space where acontrol gate is to be formed by asymmetrically controlling spacesbetween floating gates, and a method for fabricating the same.

Another embodiment of the present invention is directed to a nonvolatilememory device capable of securing a coupling ratio, and a method forfabricating the same.

In accordance with an embodiment of the present invention, a nonvolatilememory device includes: a floating gate formed over a semiconductorsubstrate; an insulator formed on a first sidewall of the floating gate;a dielectric layer formed on a second sidewall and an upper surface ofthe floating gate; and a control gate formed over the dielectric layer.

In accordance with another embodiment of the present invention, anonvolatile memory device includes: a plurality of floating gates formedover a substrate and isolated from each other by a first trench and asecond trench that are alternately provided between the plurality offloating gates, wherein the second trench having a smaller width thanthe first trench; a first isolation layer to partially gap-fill thefirst trench; a second isolation layer gap-filling the second trench; adielectric layer formed on the entire surface of the semiconductorsubstrate including the first and second isolation layers and thefloating gates; and a control gate formed over the dielectric layer togap-fill the first trench.

In accordance with yet another embodiment of the present invention, amethod for fabricating a nonvolatile memory device includes: forming aplurality of first conductive layer patterns over a semiconductorsubstrate such that the first conductive layer patterns are isolatedfrom each other by a first trench and a second trench that arealternately provided between the plurality of first conductive layerpatterns, wherein the second trench having a smaller width than thefirst trench; forming a first isolation layer to partially gap-fill thefirst trench and a second isolation layer gap-filling the second trench;and forming a plurality of floating gate by etching the first conductivepatterns; forming a dielectric layer over the entire surface of theresultant structure including the first and second isolation layers andthe floating gates; forming a second conductive layer over thedielectric layer; and forming a control gate by etching the secondconductive layer.

In accordance with still another embodiment of the present invention, amethod for fabricating a nonvolatile memory device includes: forming afirst and a second trench by etching a semiconductor substrate; forminga plurality of first conductive layer patterns over the semiconductorsubstrate such that the first conductive layer patterns are isolatedfrom each other by a first trench and a second trench that arealternately provided between the plurality of first conductive layerpatterns, wherein the second trench having a smaller width than thefirst trench; forming a first isolation layer that is recessed topartially gap-fill the first trench, and a second isolation layer whichgap-fills the second trench; forming a plurality of floating gate byetching the first conductive patterns; forming a dielectric layer overthe entire surface of the resultant structure including the first andsecond isolation layers and the floating gates; forming a secondconductive layer over the dielectric layer; and forming a control gateby etching the second conductive layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram illustrating a conventional nonvolatile memorydevice.

FIG. 2A is a diagram illustrating a nonvolatile memory device inaccordance with an embodiment of the present invention.

FIG. 2B is a cross-sectional view taken along a line of FIG. 2A.

FIGS. 3A to 3I are diagrams illustrating a method for fabricating anonvolatile memory device in accordance with the embodiment of thepresent invention.

DETAILED DESCRIPTION

Exemplary embodiments of the present invention will be described belowin more detail with reference to the accompanying drawings. The presentinvention may, however, be embodied in different forms and should not beconstrued as limited to the embodiments set forth herein. Rather, theseembodiments are provided so that this disclosure will be thorough andcomplete, and will fully convey the scope of the present invention tothose skilled in the art. Throughout the disclosure, like referencenumerals refer to like parts throughout the various figures andembodiments of the present invention.

The drawings are not necessarily to scale and in some instances,proportions may have been exaggerated in order to clearly illustratefeatures of the embodiments. When a first layer is referred to as being“on” a second layer or “on” a substrate, it not only refers to a casewhere the first layer is formed directly on the second layer or thesubstrate but also a case where a third layer exists between the firstlayer and the second layer or the substrate.

In the embodiments of the present invention, when trenches for isolationare formed, floating gates are formed to have an asymmetrical structure.Therefore, after the floating gates are formed, a dielectric layer isformed on one sidewall of each of the floating gates to secure acoupling ratio. A reduction in surface area caused by the use of onesurface may be compensated by enlarging the height of the floating gate.

Furthermore, as an increase in interference caused by mutualinterference between the floating gates is reduced by a design change orthe like, a physical limit of the floating gate may be overcome.

FIG. 2A is a diagram illustrating a nonvolatile memory device inaccordance with an embodiment of the present invention. FIG. 2B is across-sectional view taken along a line I-I′ of FIG. 2A.

Referring to FIGS. 2A and 2B, a plurality of active regions 31A areformed in a substrate 31. The plurality of active regions 31A have thesame CD. The active regions 31A are isolated by a plurality of trenches37A and 37B. The plurality of trenches includes first trenches 37A andsecond trenches 37B that are alternately formed. The CD of the firsttrench 37A is different from the CD of the second trench 37B. Forexample, the first trenches 37A have first and second spaces S11 and S13which are equal to each other. The second trenches 37B have a secondspace S12 that is smaller than the first and third spaces S11 and S13.Therefore, the first trench 37A has a larger CD than the second trench37B. The spaces S11 and S13 are larger than the spaces S1 and S3 in theconventional nonvolatile memory device, and the second space S12 issmaller than the space S2 in the conventional nonvolatile memory device.As a result, the entire area of a cell array region is not changed, butthe spaces between floating gates 105 are adjusted.

Inside the first and second trenches 37A and 37B, isolation layers areformed. Specifically, a first isolation layer 101 is formed in the firsttrenches 37A, and a second isolation layer 102 is formed in the secondtrench 37B. The height of the second isolation layer 102 is higher thanthe height of the first isolation layer 101. More specifically, thefirst isolation layer 101 has a recessed surface.

A tunnel insulation layer 32 and a floating gate 105 are stacked on eachof the active regions 31A. Since the floating gate 105 is formed incorrespondence to each of the active regions 31A, a plurality offloating gates 105 are formed. The tunnel insulation layer 32 is formedof oxide, for example, silicon oxide (SiO₂). Furthermore, after thesilicon oxide that forms the tunnel insulation layer 32 is formed, aheat treatment process using nitrogen (N₂) gas may be performed to forma nitride layer at the interface between the silicon oxide and theactive region 31A. In addition, the tunnel insulation layer 32 may beformed of metal oxide such as aluminum oxide (Al₂O₃), zirconium oxide(ZrO₂), or hafnium oxide (HfO₂), which has a dielectric constant of 3.9or more, or a mixed or stacked layer thereof. The floating gate 105 maybe formed of any conductive material, for example, any one materialselected from a polycrystalline silicon layer, a transition metal, and arare-earth metal. For example, the polycrystalline silicon layer mayinclude an un-doped polycrystalline silicon layer or impurity-dopedpolycrystalline silicon layer. If the floating gate 105 is an un-dopedsilicon layer, ion impurities are separately implanted through asubsequent ion implantation process. The transition metal may includeFe, Co, W, Ni, Pd, Pt, Mo, or Ti, and the rare-earth metal may includeEr, Yb, Sm, Y, La, Ce, Tb, Dy, Ho, Tm, or Lu.

The plurality of floating gates 105 have the same CD, but the spacesprovided alternately between the plurality of floating gates 105 havedifferent CD's. For example, a space (S12) between the floating gates105 isolated by the second isolation layer 102 is smaller than a space(S11 or S13) between the floating gates 105 isolated by the firstisolation layer 101. The first trench 37A is formed to be aligned withone sidewall of the floating gate 105, and the second trench 37B isformed to be aligned with the other sidewall of the floating gate 105.The second isolation layer 102 is formed at the other sidewall of thefloating gate 105 while gap-filling the second trench 37B.

A dielectric layer 103 is formed on the entire surface of the resultantstructure including the floating gates 105. The dielectric layer 103 hasan ONO structure. In the ONO structure an oxide 41, a nitride 42, and anoxide 43 are sequentially stacked. The dielectric layer 103 may beformed of metal oxide such as aluminum oxide (Al₂O₃), zirconium oxide(ZrO₂), or hafnium oxide (HfO₂), which has a higher dielectric constantthan that of silicon oxide, or a stacked layer or mixed layer thereof.

A control gate 104 is formed on the dielectric layer 103. The controlgate 104 may be formed of a conductive material. Desirably, the controlgate 104 may be formed of the same material as the floating gate 105.Although not illustrated, a low-resistance metal layer may be formed onthe control gate 104 to reduce the resistance of the control gate 104.The low-resistance metal layer includes a metal nitride layer, a metalsilicide layer, or a stacked layer thereof. For example, the metalnitride layer may include tungsten nitride (WN), and the metal silicidelayer may include a tungsten silicide layer (WSi₂).

According to the above descriptions, each of the floating gates 105 iscontacted with the dielectric layer 103 through one sidewall. In otherwords, each floating gate 105 contacts the dielectric layer 103 through,for example one sidewall. The floating gates 105 contact the dielectriclayer 103 through one sidewall because the second space S12 is smallerthan the first and third spaces S11 and S13 and the second isolationlayer 102 gap-fills the trench 37B to the surface of the floating gates.Therefore, the dielectric layer 103 is not formed between the floatinggates 105 above the second trenches 37B, but formed only between thefloating gates 105 above the first trenches 37A. The first isolationlayer 101 has a shorter height than the second isolation layer 102, andthe first and third spaces S11 and S13 are larger than the second spaceS12. Therefore, the dielectric layer 103 is formed along the stepprofile. Furthermore, since the first and third spaces S11 and S13 arelarger than the second space S12, the control gate 104 is formed on thedielectric layer 103 in the first and third spaces S11 and S13.

In the nonvolatile memory device in accordance with the embodiment ofthe present invention, the spaces between the respective floating gates105 are adjusted asymmetrically, as illustrated in FIGS. 2A and 2B.Therefore, a physical space to form the control gate 104 may be secured.

FIGS. 3A to 3I are diagrams illustrating a method for fabricating anonvolatile memory device in accordance with the embodiment of thepresent invention. FIGS. 3A to 3I are cross-sectional views taken alonga line of FIG. 2A.

Referring to FIG. 3A, a tunnel insulation layer 32 is formed on asemiconductor substrate 31. The tunnel insulation layer 32 is formed ofoxide, for example, silicon oxide (SiO₂). Furthermore, after the tunnelinsulation layer 32 formed of silicon oxide is formed, a heat treatmentprocess using nitrogen (N₂) gas may be performed to form a nitride layerat the interface between the silicon oxide and the semiconductorsubstrate 31. In addition, the tunnel insulation layer 32 may be formedof metal oxide such as aluminum oxide (Al₂O₃), zirconium oxide (ZrO₂),or hafnium oxide (HfO₂), or a mixed or stacked layer thereof, which hasa dielectric constant of 3.9 or more. The tunnel insulation layer 32 maybe fabricated by using a dry oxidation process, a wet oxidation process,or an oxidation process using radical ions. The tunnel insulation layer32 may be formed to a thickness of 50 to 100 Å.

A first conductive layer 33 is formed on the tunnel insulation layer 32.The first conductive layer 33 may be formed of any conductive material,for example, any one material selected from a polycrystalline siliconlayer, a transition metal, and a rare-earth metal. For example, theconductive layer 33 may be formed of the polycrystalline silicon layer,and the polysilicon layer may include an un-doped polycrystallinesilicon layer or impurity-doped polycrystalline silicon layer. In thecase of the un-doped silicon layer, ion impurities are separatelyimplanted through a subsequent ion implantation process. Thepolycrystalline silicon layer may be formed by a low pressure chemicalvapor deposition (LPCVD) process. If the polycrystalline silicon layeris used as the conductive layer 33 and the polycrystalline silicon layeris formed through LPCVD, silane (SiH₄) gas is used as source gas, andphosphine (PH₃) or arsine (AsH₃) is used as doping gas. The transitionmetal may include Fe, Co, W, Ni, Pd, Pt, Mo, or Ti, and the rare-earthmetal may include Er, Yb, Sm, Y, La, Ce, Tb, Dy, Ho, Tm, or Lu.

The first conductive layer 33 is used to form a floating gate. The firstconductive layer 33 is formed to a thickness H1, which is higher thanthe height of the floating gate 15 in the conventional nonvolatilememory device (refer to FIG. 1). This structure may compensate for areduction in coupling ratio that is caused when only one sidewall of afloating gate is contacted with a dielectric layer.

A pad layer 34 and a hard mask layer 35 are stacked on the firstconductive layer 33. The pad layer 34 includes a nitride layer such assilicon nitride (Si₃N₄), and the hard mask layer 35 includes an oxidelayer such as silicon oxide (SiO₂).

A first photoresist pattern 36 is formed on the hard mask layer 35. Thefirst photoresist pattern 36 is referred to as an ISO mask (isolationmask) for an STI process. The first photoresist pattern 36 includes aline and space pattern. Therefore, the first photoresist pattern 36 hasdesignated spaces, for example, first to third spaces S11 to S13. Thefirst space S11 is equal to the third space S13, and the second spaceS12 is smaller than the first and third spaces S11 and S13.

Referring to FIG. 3B, an STI etching process is performed. Morespecifically, the hard mask layer 35, the pad layer 34, the firstconductive layer 33, and the tunnel insulation layer 32 are sequentiallyetched using the first photoresist pattern 36 as an etching barrier, andthe semiconductor substrate 31 is etched to a designated depth.Accordingly, first and second trenches 37A and 37B are formed in thesemiconductor substrate 31. The first photoresist pattern 36 shapes thefirst and second trenches 37A and 37B (refer to FIG. 3A). Thus, thefirst trench 37A has a CD CD2 corresponding to the first or third spaceS11 or S13 of the first photoresist pattern, and the second trench 37Bhas a CD CD1 corresponding to the second space S12. Since the first andthird spaces S11 and S13 have the same CD and the second space S12 issmaller than the first and third spaces S11 and S13, the first andsecond trenches 37A and 37B are alternately formed with the first orthird space S11 or S13 and the second space S12 provided alternatively.

After the first and second trenches 37A and 37B are formed, the firstphotoresist pattern 36 may be removed, and the hard mask pattern 35Aserves as an etching barrier. Using the hard mask patter 35A as an etchbarrier, the depth and widths of the first and second trenches 37A and37B may be properly controlled depending on isolation characteristics.Accordingly, a plurality of active regions 31A are defined. The activeregions 31A have the same CD. The plurality of active regions 31A areisolated by the first and second trenches 37A and 37B.

Desirably, the CD CD2 of the first trench 37A may be larger than the CDCD1 of the second trench 37B. Furthermore, the spaces between adjacentfirst conductive layer patterns 33A may differ in correspondence to theCDs of the first and second trenches 37A and 37B. For example, the spaceS12 between the first conductive layer patterns 33A corresponding to theCD of the second trench 37B is smaller than the space S11 or S13 betweenthe first conductive layer patterns 33A corresponding to the CD of thefirst trench 37A.

After etching to form the first and second trenches 37A and 37B, theplurality of first conductive layer patterns 33A are formed. Theplurality of first conductive layer patterns 33A have the first to thirdspaces S11, S12, and S13 between the plurality of first conductive layerpatterns 33A. The plurality of first conductive layer patterns 33A areused as floating gates.

Referring to FIG. 3C, an insulator for isolation is formed. Theinsulator may include first and second insulators 38 and 39 that aresequentially formed. The first and second insulators 38 and 39 includeoxide. The first insulator 38 may serve as a liner layer. Before thefirst insulator 38 is formed, a sidewall oxidation process, which is notillustrated, may be performed. The first insulator 38 includes siliconoxide (SiO₂). The first insulator 38 is formed over the entire surfaceof the semiconductor substrate 31 including the first and secondtrenches 37A and 37B and the first hard mask layer 35. The firstinsulator 38 may be formed to at least such a thickness as to gap-fillthe second trench 37B. Accordingly, the second trench 37B is completelygap-filled with the first insulator 38, but the first trench 37A is notgap-filled because the first trench 37A has a larger CD than the secondtrench 37B. The second insulator 39 may include an un-doped silicateglass layer (hereafter, referred to HDP layer) formed by using a highdensity plasma-chemical vapor deposition (HDP-CVD) process, or a stackedlayer of an HDP layer and a spin-on-dielectric (SOD) layer. The HDPlayer has an excellent burial property, even at a high aspect ratio. TheSOD layer may include a polysilazane (PSZ) layer. In this embodiment, itis assumed that the PSZ layer is used.

In another embodiment, when a liner layer is not required, one insulatormay be used to gap-fill the first and second trenches 37A and 37B atonce. In this embodiment, the second insulator 39 may be used togap-fill the first and second trenches 37A and 37B at once.

Referring to FIG. 3D, the first and second insulators 38 and 39 areplanarized. The planarization process may be performed by an etchingprocess (for example, etch-back process) using plasma etch equipment ora chemical mechanical polishing (CMP) process. In this embodiment, theCMP process may be used to planarize the first and second insulators 38and 39 until the pad layer 34 is exposed. The pad layer 34 serves as apolishing stop layer.

Through the planarization process, first and second insulator patterns38A and 39A are formed. The first and second insulator patterns 38A and39A gap-fill the inside of the first trench 37A. In other words, thefirst and second insulator patterns 38A and 39A gap-fill the first orthird space between the first conductive layer patterns 33A. Meanwhile,for example, only the first insulator pattern 38B remains in the secondtrench 37B. In other words, only the first insulator pattern 38B remainsbetween the first conductive layer patterns 33A at the upper portion ofthe second trench 37B, more specifically, in the second space S12.

Referring to FIG. 3E, the pad layer 34 is removed. The pad layer 34 isremoved by using wet etching or dry etching. Desirably, wet etching maybe used to remove the pad layer 34. When the pad layer 34 is formed ofnitride, a phosphoric acid (H₃PO₄) solution may be used to remove thepad layer 34.

When the pad layer 34 is removed, the first and second insulatorpatterns 38A, 39A, and 39B may be partially removed.

Referring to FIG. 3F, the first and second insulator patterns 38A and39A are partially recessed to form a first isolation layer 101, which isrecessed to a designated depth inside the first trench 37A. The firstisolation layer 101 includes the first and second insulator patterns 38Aand 39A.

The recess process is performed to control an effective field oxideheight (EFH). In order to perform the recess process, for example, onlyon a cell region, a second photoresist pattern (referred to as PCL mask)40 is used as an etching barrier. The second photoresist pattern 40serves to close a peripheral circuit region, which is not illustrated,and open only the cell region. Furthermore, the second photoresistpattern 40 may be formed in the cell region so that the second insulatorpattern 39B is not recessed by the recess process. More specifically,the second insulator pattern 39B between the first conductive layerpatterns 33A having a small space (S2) is closed, and the first andsecond insulator patterns 38A and 39A between the first conductive layerpatterns 33A having a large space (S1 and S3) are opened. The recessprocess is performed by a wet etching or dry etching process.

Through the recess process, the upper surface of the first isolationlayer 101 is positioned at a height of 350˜400 Å from the semiconductorsubstrate, more specifically, the upper surface of the active region31A. Furthermore, an upper corner of the first conductive layer pattern33A may be rounded by the recess process. One corner of each of thefirst conductive layer patterns 33A is rounded because one sidewall ofeach of the first conductive layer patterns 33A is exposed by the recessprocess.

Meanwhile, the second insulator pattern 39B remaining in the secondtrench 37B is referred to as a second isolation layer 102.

Referring to FIG. 3G, the second photoresist pattern 40 is stripped, anda cleaning process is then performed.

When the second photoresist pattern 40 is stripped, the plurality offirst conductive layer patterns 33A have one sidewall thereof isexposed. The first conductive layer patterns 33A adjacent with the firstor third space S1 or S3 have one sidewall exposed after recessing thefirst isolation layer 101. Furthermore, the other sidewall of the firstconductive patterns 33A is not exposed because the second isolationlayer 102 is not recessed.

As a result, the plurality of first conductive layer patterns 33A areformed with the first or third space S11 or S12 and the second spaceS12, which are alternately provided between the plurality of firstconductive patters 33A.

Referring to FIG. 3H, a dielectric layer 103 is formed on the entiresurface of the resultant structure including the first and secondisolation layers 101 and 102 and the first conductive layer patterns33A. At this time, the dielectric layer 103 has an ONO structure. TheONO structure sequentially stacks an oxide 41, a nitride 42, and anoxide 43. In addition, the dielectric layer 103 may be formed of metaloxide such as aluminum oxide (Al₂O₃), zirconium oxide (ZrO₂), or hafniumoxide (HfO₂), which has a higher dielectric constant than that ofsilicon oxide, or a stacked layer or mixed layer thereof.

When the dielectric layer 103 is formed in such a manner, a designatedgap 44 may be secured in the first and third spaces. This structure maybe formed because the first and third spaces are larger than the secondspace. Meanwhile, since the dielectric layer 103 is not formed in thesecond space, the dielectric layer 103 is in contact with one sidewallof each of the plurality of first conductive layer pattern 33A.

Referring to FIG. 3I, a second conductive layer to be used as a controlgate 104 is formed on the dielectric layer 103. At this time, the secondconductive layer may be formed of a conductive material. According to anexample, the second conductive layer may be formed of the same materialas the first conductive layer pattern 33A. Although not illustrated, alow-resistance metal layer may be formed on the second conductive layerto reduce the resistance of the control gate. The low-resistance metallayer may include a metal nitride layer, a metal silicide layer, or astacked layer thereof. For example, the metal nitride layer may includetungsten nitride (WN), and the metal silicide layer may include tungstensilicide (WSW.

Although not illustrated, a gate etching process is subsequentlyperformed. More specifically, the second conductive layer is etched in aline type extended in any one direction to form the control gate 104,and the dielectric layer 103 and the first conductive layer pattern 33Aunder the control gate 104 are etched. Accordingly, as illustrated inFIGS. 2A and 2B, the nonvolatile memory device has a plane structurewhere the plurality of floating gates 105 are arranged under the controlgate 104. The plurality of floating gates 105 becomes single sidefloating gates (FG) that have one sidewall contacted with the dielectriclayer 103.

According to the above descriptions, as the spaces between the floatinggates 105 are formed asymmetrically, a physical limit of the floatinggates 105 may be overcome. More specifically, after the dielectric layer103 is deposited, a physical space where the control gate 104 is to beformed may be sufficiently secured in the space between the floatinggates 105 corresponding to the first or third space.

Furthermore, since the recess process of the isolation layer 101 isperformed in a state where a wide space is provided, the EFH may becontrolled.

In accordance with the embodiments of the present invention, the spacesbetween the floating gates may be asymmetrically formed to overcome aphysical limit of the floating gates. Therefore, a NAND type flashmemory using floating gates even in a 10 nm class flash memory field maybe fabricated:

Furthermore, since the EFH is easy to control in a state where a widespace is provided, the uniformity of device characteristics may beimproved depending on an EFH variation.

While the present invention has been described with respect to thespecific embodiments, it will be apparent to those skilled in the artthat various changes and modifications may be made without departingfrom the spirit and scope of the invention as defined in the followingclaims.

1. A nonvolatile memory device comprising: a floating gate formed over asemiconductor substrate; an insulator formed on a first sidewall of thefloating gate; a dielectric layer formed on a second sidewall and anupper surface of the floating gate; and a control gate formed over thedielectric layer.
 2. The nonvolatile memory device of claim 1, whereinthe semiconductor substrate comprises a first trench aligned with thesecond sidewall of the floating gate and a second trench aligned withthe first sidewall of the floating gate, and the insulator is formed onthe first sidewall of the floating gate while gap-filling the secondtrench.
 3. The nonvolatile memory device of claim 2, further comprisingan isolation layer to gap-fill the first trench, wherein the isolationlayer has a height to expose the second sidewall of the floating gate.4. The nonvolatile memory device of claim 1, further comprising a tunnelinsulation layer formed between the semiconductor substrate and thefloating gate.
 5. The nonvolatile memory device of claim 1, wherein theinsulator comprises an oxide layer.
 6. The nonvolatile memory device ofclaim 1, wherein the dielectric layer has an oxide-nitride-oxide (ONO)structure, with sequentially stacked oxide layer, nitride layer, andoxide layer.
 7. A nonvolatile memory device comprising: a plurality offloating gates formed over a substrate and isolated from each other by afirst trench and a second trench that are alternately provided betweenthe plurality of floating gates, wherein the second trench having asmaller width than the first trench; a first isolation layer topartially gap-fill the first trench; a second isolation layergap-filling the second trench; a dielectric layer formed on the entiresurface of the semiconductor substrate including the first and secondisolation layers and the floating gates; and a control gate formed overthe dielectric layer to gap-fill the first trench.
 8. The nonvolatilememory device of claim 7, wherein the plurality of floating gatescomprise single side floating gates having a sidewall that contacts thedielectric layer.
 9. The nonvolatile memory device of claim 7, whereinthe first and second isolation layers comprises an oxide layer.
 10. Thenonvolatile memory device of claim 7, wherein the dielectric layer hasan ONO structure, wherein oxide, nitride, and oxide are sequentiallystacked.
 11. The nonvolatile memory device of claim 7, wherein first andsecond trenches are formed in the semiconductor substrate, and aplurality of active regions isolated by the first and second trenches12. The nonvolatile memory device of claim 7, wherein first and secondtrenches are formed in the semiconductor substrate, and a plurality ofactive regions isolated by the first and second trenches, the floatinggates are formed over the respective active regions, and a tunnelinsulation layer is provided in between the active regions and thefloating gates.
 13. A method for fabricating a nonvolatile memorydevice, comprising: forming a plurality of first conductive layerpatterns over a semiconductor substrate such that the first conductivelayer patterns are isolated from each other by a first trench and asecond trench that are alternately provided between the plurality offirst conductive layer patterns, wherein the second trench having asmaller width than the first trench; forming a first isolation layer topartially gap-fill the first trench and a second isolation layergap-filling the second trench; forming a plurality of floating gates byetching the first conductive patterns; forming a dielectric layer overthe entire surface of the resultant structure including the first andsecond isolation layers and the floating gates; forming a secondconductive layer over the dielectric layer; and forming a control gateby etching the second conductive layer.
 14. The method of claim 13,wherein the forming of the first isolation layer and the secondisolation layer comprises: forming an insulator over the entire surfaceof the semiconductor substrate to gap-fill the first and secondtrenches; planarizing the insulator until upper surfaces of the firstconductive layer patterns are exposed; forming a mask pattern to closethe second trench; and recessing the insulator gap-filling the firsttrench by using the mask pattern as an etching barrier.
 15. The methodof claim 13, wherein the first and second isolation layers comprises anoxide layer.
 16. The method of claim 13, wherein the dielectric layerhas an ONO structure, with sequentially stacked oxide layer, nitridelayer, and oxide layer.
 17. The method of claim 13, wherein the formingof the plurality of first conductive layer patterns comprises: forming atunnel insulation layer, a first conductive layer, a pad layer, and ahard mask layer over the semiconductor substrate; forming a photoresistpattern over the hard mask layer, the photoresist pattern defining thefirst and second trenches; and etching the hard mask layer, the padlayer, the first conductive layer, and the tunnel insulation layer byusing the photoresist pattern as an etching barrier.
 18. A method forfabricating a nonvolatile memory device, comprising: forming a first anda second trench by etching a semiconductor substrate; forming aplurality of first conductive layer patterns over the semiconductorsubstrate such that the first conductive layer patterns are isolatedfrom each other by the first trench and the second trench that arealternately provided between the plurality of first conductive layerpatterns, wherein the second trench having a smaller width than thefirst trench; forming a first isolation layer that is recessed topartially gap-fill the first trench, and a second isolation layer whichgap-fills the second trench; forming a plurality of floating gate byetching the first conductive patterns; forming a dielectric layer overthe entire surface of the resultant structure including the first andsecond isolation layers and the floating gates; forming a secondconductive layer over the dielectric layer; and forming a control gateby etching the second conductive layer.
 19. The method of claim 18,wherein the forming of the first isolation layer and the secondisolation layer comprises: forming an insulator over the entire surfaceof the semiconductor substrate to gap-fill the first and secondtrenches; planarizing the insulator until upper surfaces of the firstconductive layer patterns are exposed; forming a mask pattern to closethe second trench; and recessing the insulator gap-filling the firsttrench by using the mask pattern as an etching barrier.
 20. The methodof claim 18, wherein the first and second isolation layers comprises anoxide layer.
 21. The method of claim 18, wherein the dielectric layerhas an ONO structure, with sequentially stacked oxide layer, nitridelayer, and oxide layer are sequentially stacked.
 22. The method of claim18, wherein the forming of the plurality of first conductive layerpatterns comprises: forming a tunnel insulation layer, a firstconductive layer, a pad layer, and a hard mask layer over thesemiconductor substrate; forming a photoresist pattern over the hardmask layer, the photoresist pattern defining the first and secondtrenches; and etching the hard mask layer, the pad layer, the firstconductive layer, and the tunnel insulation layer by using thephotoresist pattern as an etching barrier.
 23. The method of claim 18,wherein the forming of the first isolation layer and the secondisolation layer comprises: forming a first insulator over the entiresurface of the semiconductor substrate such that the first insulatorgap-fills the second trench; forming a second insulator over the firstinsulator such that the second insulator gap-fills the first trench;planarizing the first and second insulators until upper surfaces of thefirst conductive layer patterns are exposed; forming a mask pattern toclose the second trench; and recessing the first and second insulatorsgap-filling the first trench by using the mask pattern as an etchingbarrier.